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The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
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2017
Journal Article
Title
The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
Author(s)
Ramm, Peter
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Poupon, Gilles
CEA Leti
Couderc, Pascal
3D PLUS
Leitgeb, Markus
AT&S
Taklo, Maaike M.V.
SINTEF
Journal
Advancing microelectronics
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Keyword(s)
device packaging
3D integration
wafer-level packaging
sensors
