Roll-to-Roll deposition of silicon-plasma polymers

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a thin film coating technology that is broadly applied for the deposition of both inorganic and organic coatings on all kinds of substrates. One of the advantages of the PECVD compared to thermal CVD is the possibility to use low substrate temperatures and thereby coat temperature sensitive substrates like polymer films. These coatings find broad applications as dielectric layer, scratch resistant coating or in food packaging. Recently, PECVD is used for barrier coatings for flexible organic electronics, part of optical coatings systems for e.g. solar control films or as an anti-reflective layer as well.