Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System

Advanced packaging technologies open new perspectives for system designers. Fan-in/out wafer level packaging technologies (e.g., eWLB) and 2.5D/3D integration(e.g., die stacking) as well as the combination of traditional system integration techniques (e.g., Flip Chip, Wire Bonding, Package-on-Package) enable an enrichment of the design space. Such advanced packaging technologies facilitate systems with reduced footprint and/or thinner packages for mobile, wearable and medical applications, higher pin count and reduced power consumption. Most of these new package types are also open for the integration of existing components (e.g., bare dies) which saves NRE costs and/or time to market during the system development process.The designers of such modern electronic systems, e.g. (medical-)sensor systems or memory-processor systems, face challenges like: Find an optimal packaging setup and technology combination considering performance, cost, supply chain, and reliability or interlink design data from different origins and handle it simultaneously in a consistent way. In addition to these economical and technical aspects, physical effects have to be considered as well. In this chapter we specifically address the electrical, mechanical, and thermal domain. Furthermore, the multi-physical couplings within a highly integrated system are of particular importance.