Introduction to Design, Test and Thermal Management of 3D Integrated Circuits

2019

Aufsatz in Buch

Author(s)

Garrou, Philip

Microelectronics Consultants of NC

Koyanagi, Mitsumasa

Tohoku University

Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT

Hauptwerk

Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits