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2017
Journal Article
Title

Highly integrated chips

Title Supplement
Super-brains for the IoT age
Abstract
Without microelectronics, the ""Internet of Things"" (IoT) would be blind, deaf, and mute. But in order to be able to keep up with rapid development in this digital age, chips must become smaller, more multifunctional, and more powerful. 3D integration is considered a key technology in order to keep moving the boundaries of the possible further out.
Author(s)
Ramm, P.
Weber, J.
Mainwork
Fraunhofer VµE - Microelectronics News. Ausgabe 65  
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
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