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  4. Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices
 
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2017
Zeitschriftenaufsatz
Titel

Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices

Abstract
We present a new epoxy-based negative-tone dry film photoresist (DFR) for fabricating multilayer microfluidic devices using a lamination process combined with a standard photolithography technology. As proof-of-concept, a complex 3D-hydrodynamic focusing device was produced via a six-layer lamination process of 33 µm-thick DFR layers. The bonding strength of the new DFR was tested on silicon, glass, and titanium substrates, respectively. A maximum bonding strength of 37 MPa was obtained for the dry film photoresist laminated on glass. No leakage was found, and burst tests proved excellent robustness and sealing reliability of the microchannels.
Author(s)
El Hasni, Akram
Institute of Materials in Electrical Engineering 1, RWTH Aachen
Pfirrmann, Stefan
Micro Resist Technology GmbH,
Kolander, Anett
Micro Resist Technology GmbH
Yacoub-George, Erwin
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
König, Martin
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Landesberger, Christof
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Voigt, Anja
Micro Resist Technology GmbH
Grützner, Gabi
Micro Resist Technology GmbH
Schnakenberg, Uwe
Institute of Materials in Electrical Engineering 1, RWTH Aachen
Zeitschrift
Microfluidics and nanofluidics
Project(s)
LamiRes
Funder
Bundesministerium für Wirtschaft und Technolgie BMWi (Deutschland)
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DOI
10.1007/s10404-017-1877-8
Language
Englisch
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EMFT
Tags
  • microfluidic

  • flow focusing

  • dry film photoresist

  • microfabrication

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