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  4. Interfacial void segregation of Cl in Cu-Sn micro-connects
 
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2017
Journal Article
Title

Interfacial void segregation of Cl in Cu-Sn micro-connects

Abstract
A scanning transmission electron microscopy and an energy dispersive X-ray analysis of one non-annealed and one annealed sample (423 K for 4 hours) was performed. The results showed small and large voids appearing within the non-annealed and annealed samples respectively. In addition, chlorine segregated from the bulk into the voids. Ab initio calculations determined the formation energies for dilute solutions of chlorine and vacancies in Cu, Cu3Sn and Cu6Sn5. Results suggest that dilute solutions energetically favor vacancies, indicating a low chlorine solubility and a driving force for segregation.
Author(s)
Ross, G.
Tao, X.
Broas, M.
Mäntyoja, N.
Vuorinen, V.
Graff, A.
Altmann, F.
Petzold, M.
Paulasto-Kröckel, M.
Journal
Electronic materials letters  
DOI
10.1007/s13391-017-6304-5
Language
English
Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS  
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