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Thin chip foil packaging: An enabling technology for ultra-thin packages
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2016
Journal Article
Titel
Thin chip foil packaging: An enabling technology for ultra-thin packages
Author(s)
Landesberger, C.
Palavesam, N.
Drost, A.
Hell, W.
Faul, R.
Kutter, C.
Zeitschrift
Chip scale review
Language
English
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Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT