Particle free handling of substrates

Semiconductor technology is heading toward the 10 nm node and even smaller in the coming years. This development relies not only on new process technologies, like lithography techniques, but also on safer and cleaner handling techniques that meet the high-end requirements of the production line. In this paper, the evaluation of different end-effectors and handling techniques regarding particle generation, organic, and metallic contamination effects will be discussed. Bernoulli, ultrasonic, carbon, and standard vacuum end-effectors are being tested and compared with each other for the handling of 300 mm wafers.