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  4. Long-term and annealing stable, solderable PVD metallization with optimized Al diffusion barrier
 
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2015
Journal Article
Title

Long-term and annealing stable, solderable PVD metallization with optimized Al diffusion barrier

Abstract
Since passivated emitter and rear cells (PERC) and other silicon solar cell concepts with evaporated aluminum (Al) as rear metallization are incompatible with a common solder process, in this work an annealing stable,solderable and long-term stable metallization scheme deposited by physical vapor deposition (PVD) is developed. The solder stack that complements the Al metallization consists of sputter deposited TiN/Ti/Ag or TiN/NiV/Ag, whereby the TiN layer serves as a diffusion barrier against Al. It is therefore optimized by varying sputter parameters and by stuffing the grain boundaries with oxygen. On the optimized stack a cell-interconnector can be conventionally soldered even after a strong annealing step of 15 min at 425 °C, which sets this concept apart from other PVD metallization approaches. Cell efficiency is not influenced by the solder stack compared to a reference rear metallization by plain evaporated Al. Additionally, long-term stability of the solder-joints on the metallization schemeis investigated by thermal aging of solder-joints and thermal cycling of demo moduleswith PERC cells.
Author(s)
Kumm, J.
Chacko, R.V.
Samadi, H.
Hartmann, P.
Eberlein, D.
Jäger, U.
Wolf, A.
Journal
Energy Procedia  
Conference
International Conference on Crystalline Silicon Photovoltaics (SiliconPV) 2015  
Open Access
DOI
10.24406/publica-r-241509
10.1016/j.egypro.2015.07.052
File(s)
N-366847.pdf (492.98 KB)
Rights
CC BY-NC-ND 4.0: Creative Commons Attribution-NonCommercial-NoDerivatives
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Fraunhofer-Institut für Solare Energiesysteme ISE  
Keyword(s)
  • PV Produktionstechnologie und Qualitätssicherung

  • Silicium-Photovoltaik

  • Kontaktierung und Strukturierung

  • Pilotherstellung von industrienahen Solarzellen

  • Modulintegration

  • metallization

  • TiN

  • barrier

  • Soldering

  • stability

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