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  4. Implantable MEMS sensors and medical MEMS packaging issues for future implants
 
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2014
Journal Article
Title

Implantable MEMS sensors and medical MEMS packaging issues for future implants

Abstract
The paper shows the potential of micro machined sensors for implantation and monitoring of patients. Next to well known sensors it is focused on inertial sensors and a way for further miniaturization keeping the performance and accuracy of the sensor. Furthermore the ongoing investigation of materials used for MEMS packaging and MEMS fabrication will be described. Here, special encapsulation techniques should show a miniaturization potential realized by the substitution of thick medical packages like Titanium housings.
Author(s)
Baum, Mario  
Haubold, M.
Wiemer, Maik  
Geßner, Thomas  
Journal
Biomedizinische Technik  
Conference
Deutsche Gesellschaft für Biomedizinische Technik (DGBMT Jahrestagung) 2014  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
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