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Investigation of low temperature wafer bonding using plasma activation
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2014
Book Article
Title
Investigation of low temperature wafer bonding using plasma activation
Author(s)
Wünsch, Dirk
Hofmann, C.
Bräuer, J.
Wiemer, Maik
Geßner, Thomas
Mainwork
Smart systems integration for micro- and nanotechnologies
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
