• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Artikel
  4. Non-isothermal model experiments and numerical simulations for directional solidification of multicrystalline silicon in a traveling magnetic field
 
  • Details
  • Full
Options
2013
Journal Article
Title

Non-isothermal model experiments and numerical simulations for directional solidification of multicrystalline silicon in a traveling magnetic field

Abstract
A new experimental setup containing a GaInSn melt with a square horizontal cross section of 10×10 cm2 and a variable melt height up to 10 cm has been developed. The melt is positioned in the center of a coil system generating a traveling magnetic field (TMF). Using a cooling system at the bottom and a heating system at the top of the melt, a vertical temperature difference up to approximately 50 K can be applied to the melt, imitating the thermal conditions during the directional solidification of multicrystalline silicon. Direct measurements of the time-dependent velocity and the temperature profiles were performed using ultrasonic Doppler velocimetry and thermocouples, respectively. Complementary three-dimensional (3D) numerical simulations of the model experiments were used to validate the numerical tools and to gain a deeper insight into the characteristics of TMF flows in square melts. The classical toroidal flow structure known from isothermal cylindrical melts is shown to obtain a large horizontal central vortex at a small height of the square melt, whereas a distinct 3D asymmetry appears at a large height. A vertical temperature gradient tends to suppress the vertical melt motion and leads to new complex horizontal flow structures.
Author(s)
Dadzis, K.
Niemietz, K.
Pätzold, O.
Wunderwald, U.  
Friedrich, J.  
Journal
Journal of Crystal Growth  
DOI
10.1016/j.jcrysgro.2013.02.030
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024