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2012
Journal Article
Titel
AMALITH: Advanced mask aligner lithography
Abstract
As predicted by Moore's law, the number of components in integrated circuits is ever-growing. Since the mid-1970s the need of smaller and smaller feature sizes in semiconductor manufacturing has encouraged the development of new technologies as Lithography Projection Systems. Nevertheless, because of its comparatively low cost of ownership, versatility and easy handling, many companies, research centres and universities still employ Mask Aligners. Advanced Mask Aligner Lithography (AMALITH) makes it possible to overcome some application limits for this technology, by introducing innovative concepts to shadow printing. This approach, in combination with lithography simulations, enables the use of Resolution Enhancement Technologies, already employed in front end processes. We will show some application of complex mask layers based on Diffractive Optical Elements (DOE) as Fresnel Zone Plates or Diffractive Beam Splitters for process quality improvement and control. Optical Proximity Correction (OPC), Source Mask Optimization (SMO) and Phase-Shift Masks (PSM) have been used for increasing the process window, the resolution and the accuracy of the resulting photoresist profile.