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  4. Electronic design automation for implementation of 3D integrated systems
 
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2011
Book Article
Title

Electronic design automation for implementation of 3D integrated systems

Abstract
The technology of vertical integration using Through Silicon Vias (TSVs) now is mature for commercial products with a smaller form factor, better performance, less power consumption and lower cost. This paper addresses two challenges faced with the design using vertical integration. First, methods for the characterization of the physical behavior of the new interconnect structures are described. Second, since issues of reliability and thermal management become more important and difficult and the design space is drastically larger, new early stage design tools are needed. A new floorplanning flow is introduced which supports the cost and performance optimized implementation of digital systems in a stack.
Author(s)
Knöchel, Uwe
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Heinig, Andy  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Stolle, Jörn
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Reitz, Sven  orcid-logo
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Wilde, Andreas  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Mainwork
Microelectronic systems. Circuits, systems and applications  
File(s)
Download (690.15 KB)
Rights
Use according to copyright law
DOI
10.24406/publica-r-226094
10.1007/978-3-642-23071-4_3
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
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