Strength and reliability testing for silicon based MEMS

In this paper, theoretical fracture mechanics concepts as well as strength and fatigue testing methods will be presented which can be applied for strength and lifetime prediction, design consideration, quality assessment and failure analysis of mechanically loaded silicon and wafer-bonded MEMS (Micro Electro Mechanical Systems). Special attention is given to etched (anistropic and isotropic) single crystalline silicon devices, polycrystalline thin film materials and wafer-bonded components.