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Rotational grinding of silicon wafers-sub-surface damage inspection
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2004
Journal Article
Title
Rotational grinding of silicon wafers-sub-surface damage inspection
Author(s)
Haapalinna, Atte
Nevas, Saulius
Pahler, Dietmar
Journal
Materials Science and Engineering, B. Solid state materials for advanced technology
DOI
10.1016/j.mseb.2003.12.008
Language
English
Fraunhofer-Institut für Produktionstechnologie IPT
