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Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
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2004
Journal Article
Titel
Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
Author(s)
Manessis, D.
Patzelt, R.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Zeitschrift
Microelectronics reliability
DOI
10.1016/S0026-2714(03)00361-5
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM