MID technology: New applications, materials, plating concepts

Molded Interconnect Devices (MID) technology is relatively new for the manufacturing of components with integrated electrical and mechanical functions. The elctrical functions are achieved by partial metallization of the plastic substrate. In this edited version of a presentation from SUR/FIN 2000 Chicago, two important substrate materials - liquid crystal polymer (LCP) and polyamide - are presented, and the different concepts for selective plating by electroless plating technologies (copper, nickel) are discussed. The end finish is generally built up by electroplating (e. g. copper or tin) or by electroless nickel/immer-sion gold. New MID applications for mechatronics are presented.