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Single chip bumping and reliability for flip chip processes
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1999
Journal Article
Title
Single chip bumping and reliability for flip chip processes
Author(s)
Klein, M.
Oppermann, H.
Kalicki, R.
Aschenbrenner, R.
Reichl, H.
Journal
Microelectronics reliability
DOI
10.1016/S0026-2714(99)00067-0
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
