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1999
Journal Article
Title
Deposition of SiOx films from O2/HMDSO plasmas
Abstract
The variation of 02/HMDSO ratio in an r.f. plasma was carried out to optimize SiOx film properties and deposition rates for the coating of polymers. A ratio exceeding 6:1 yields scratch resistant, quartz-like films with low carbon contents. The chemical composition was analyzed to SiO(1.8)C(0.3) by XPS. A compact plasma reactor was developed generating homogeneous plasmas and depositions over large areas (up to 380 x 290 mm2). Furthermore, the total coverage of three-dimensional formed parts was managed with good adhesion of SiOx films to polymers like PC and PBT to reduce wear.
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