English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Have you forgotten your password?
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Low cost flip chip bonding on FR-4 boards
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1995
Journal Article
Title
Low cost flip chip bonding on FR-4 boards
Author(s)
Klöser, J.
Zakel, E.
Reichl, H.
Journal
Circuit World
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
