Long Term Reliability and Deterioration Mechanisms of High-Temperature Metal Stacks on 4H-SiC

In order to make SiC devices more accessible for high-temperature applications, reliable ohmic contacts and metallization systems which can also withstand extended operation at high temperatures are needed. In this work, metal layer stacks containing Ag, Ti, TiN, Ni and NiAl, where NiAl refers to a mixture of 97,4 wt% Ni and 2,6 wt% Al, were deposited on Si and SiC samples and consecutively thermally aged at 400 °C for 100 h in air. Mesa structures were found to be challenging for keeping oxygen from diffusing through the metal stack to the substrate. On flat surfaces, diffusion barriers were successfully used to protect the ohmic contact on 4H-SiC samples from oxidizing. Diffusion barriers made of TiN were found to show pore formation after the thermal treatment. The reason for the pores is thought to be gas formation, which is believed to be the result of the TiN layers containing too much nitrogen. The exact chemical composition of TiN layers therefore seems to be of vital importance for high-temperature applications.