Application of solid mechanics in the fields of microelectronics and micro system technology

Failure analysis and reliability problems habe become very important in recent years in many fields of microelectronics. The authors deal with mechanical and thermal problems of failure mechanisms of single components and interconnects in microsystems. Combined theoretical and experimental approach is described. SMD-components on printed circuit boards are evaluated by means of FE analysis and experimental methods (holography, speckle measurements). The micro deformation analysis (microDAC) is applied too.