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2018
Conference Paper
Title
PCB-embedding for GaN-on-Si power devices and ICs
Abstract
This paper investigates a printed circuit board (PCB)-embedding technology as packaging technology for 600 V class GaN-on-Si power devices and power integrated circuits (ICs). The electrical and thermal characteristics of PCB embedding are investigated and compared to conventional assemblies based on wire-bonding and soldering.
Author(s)
Language
English