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The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction
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2008
Journal Article
Title
The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction
Author(s)
Yu, D.Q.
Wang, L.
Journal
Journal of alloys and compounds
DOI
10.1016/j.jallcom.2007.04.047
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
