2013
Conference Paper
Title

Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly

Author(s)
Oliver, M.
Kim, J.-U.
Wang, Z.
Okada, J.
Iagodkine, E.
Choubey, A.
Anzures, E.
Fleming, D.
Dhoble, A.
Truong, C.
Gallagher, M.
Zoschke, K.
Wegner, M.
Töpper, M.
Mainwork
Conference
Language
English