• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Analysis of wave propagation along coaxial through silicon vias using a matrix method
 
  • Details
  • Full
Options
2014
Conference Paper
Title

Analysis of wave propagation along coaxial through silicon vias using a matrix method

Abstract
This paper presents an efficient method for the determination of the dispersion relation of wave propagation along coaxial structures with radially layered dielectric filling based on a matrix method known from the theory of optical waveguides. The method is applied for investigations of coaxial through silicon vias having different dimensions and different conductivities of the silicon semiconductor filling. The fundamental modes are derived, results are correlated to full-wave simulation results, and the physical phenomena of quasi TEM, slow-wave and skin-effect propagation in the fundamental mode are discussed with regard to signal integrity.
Author(s)
Dahl, D.
Beyreuther, A.
Duan, X.
Ndip, I.
Lang, K.-D.
Schuster, C.
Mainwork
IEEE 18th Workshop on Signal and Power Integrity, SPI 2014  
Conference
Workshop on Signal and Power Integrity (SPI) 2014  
DOI
10.1109/SaPIW.2014.6844539
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024