Laser-based glass soldering for MEMS packaging

The work carried out in this study deals with the development of a laser-based glass soldering process. This process is applied to the assembly of two glass plates as encountered in the manufacturing of display devices. The main guidelines of the laser process setting up are mainly to avoid any overheating of the parts and to insure a hermetic bonding of the assembly. Thermal modeling of the process is therefore carried out to guide the experimental developments. Then, visual and microscopy analysis of the soldered joints are done to point out the feasibility of the process.