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  4. Nondestructive topographic resistivity evaluation of semi-insulating SiC substrates
 
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2003
Journal Article
Title

Nondestructive topographic resistivity evaluation of semi-insulating SiC substrates

Other Title
Zerstörungsfreie topografische Widerstandsmessung semi-isolierender SIC-Substrate
Abstract
Semi-insulating silicon carbide single crystals have been grown using high temperature chemical vapor deposition without vanadium doping. The resistivity of standard and exploratory 2" diameter substrates has been analysed topographically with 1 mm lateral resolution with an improved contactless resistivity mapping technique. Absolute resistivity values are ranging from below 1 x 10(exp5) to above 1 x 10(exp12) ohm cm. The lateral homogeneity of state-of-the-art material is very satisfactory, whereas strong localized inhomogeneities in exploratory materials underscore the decisive advantage of a nondestructive and topographic resistivity evaluation in supporting the optimization of the crystal growth procedure.
Author(s)
Stibal, R.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Müller, Stefan
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Jantz, W.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Pozina, G.
Magnusson, B.
Ellison, A.
Journal
Physica status solidi. C  
DOI
10.1002/pssc.200306237
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • resistivity

  • spezifischer Widerstand

  • semi-insulating

  • semi-isolierend

  • substrat

  • SiC

  • topography

  • Topographie

  • measurement

  • HTCVD

  • crystal growth

  • Kristallzucht

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