System Integration for High Frequency Applications

Thin film multilayer substrate technology with dielectric polymer layers and sputtered/electroplated wiring provide the highest line density per layer and therefore they are of special interest for MCM applications. A planar integration technology of bare dice embedded in ceramic substrates is used. The components are inserted into premanufactured windows of ceramic substrates and fixed in their position by epoxy. A thin film multilayer is realized in a planar fashion on top of the embedded system. The metallization is based on a Ti:W/ Cu tie layer, which is subsequently electroplated with Cu. Polyimid Pyralin (TM) 2722 (Du Pont) and Cyclotene (TM) 4026-46 (Dow Chemical) are used as interlevel dielectric. The paper addresses the transmission lines characteristics (MS and CPW) for the chip substrate interconnection. Furthermore, the effect of the meshed ground plane on the line parameter impedance is discussed. The dielectric polymer layers are characterized by the effective permittivity and the loss factor.