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  4. Packaging of an electronic-microfluidic hybrid sensor
 
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2003
Conference Paper
Title

Packaging of an electronic-microfluidic hybrid sensor

Abstract
Biotechnology and microelectronics have begun to merge to form an alliance in battling diseases, analyzing hazardous ambients and much more. Crucial for this was the development of microfluidic components and respective microelectronic based sensors. As mass manufacturing allows to bring the research results from the lab to the market, solutions to merge the two disciplines in a cost effective, performance oriented way are needed. Packaging can play a crucial role here, as a seamless integation of microfluidics and microelectronics paves the way to commercially attractive products. The paper describes the development of a packaging strategy for the seamless integration of a microfluidic structured carrier and a sensor chip in a prototype package that can easily be upscaled to production. The concept, the applied technologies and dimensioning will be described.
Author(s)
Jung, E.
Assmann, R.
Aschenbrenner, R.
Reichl, H.
Mainwork
53rd Electronic Components & Technology Conference 2003. Proceedings  
Conference
Electronic Components and Technology Conference (ECTC) 2003  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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