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  4. Charge trapping in gate-drain access region of AlGaN/GaN MIS-HEMTs after drain stress
 
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2015
Conference Paper
Titel

Charge trapping in gate-drain access region of AlGaN/GaN MIS-HEMTs after drain stress

Abstract
In this paper we investigate the drain stress behavior and charge trapping phenomena of GaN-based high electron mobility transistors (HEMTs). We fabricated GaN-on-Si MIS-HEMTs with different dielectric stacks in the gate and gate drain access region and performed interface characterization and stress measurements for slow traps analysis. Our results show a high dependency of the on-resistance increase on interfaces in the gate-drain access region. The dielectric interfaces near the channel play a significant role for long term high voltage stress and regeneration of the device.
Author(s)
Jauss, S.A.
Schwaiger, S.
Daves, W.
Noll, S.
Ambacher, O.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF
Hauptwerk
45th European Solid-State Device Research Conference, ESSDERC 2015. Proceedings
Konferenz
European Solid-State Device Research Conference (ESSDERC) 2015
Thumbnail Image
DOI
10.1109/ESSDERC.2015.7324712
Language
English
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Fraunhofer-Institut für Angewandte Festkörperphysik IAF
Tags
  • GaN

  • MIS-HEMT

  • current collapse

  • drain stress

  • access region

  • traps

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