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Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
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2009
Conference Paper
Title
Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Author(s)
Manessis, D.
Böttcher, L.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Mainwork
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.1
Conference
Electronic Components and Technology Conference (ECTC) 2009
DOI
10.1109/ECTC.2009.5074057
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
