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  4. Detecting Local Delamination of Power Electronic Devices through Thermal-Mechanical Analysis
 
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2021
Conference Paper
Title

Detecting Local Delamination of Power Electronic Devices through Thermal-Mechanical Analysis

Abstract
Die attachment delamination is one of the most common defects that happen over the life-time of a power electronic module [1]. It is usually the consequence of thermal mechanical stress that occurs during active operation of the device due to CTE (coefficient of thermal expansion) mismatch of its components. Additionally, even during the production cycles, errors can emerge, where the chip is not fully attached to the substrate. This can lead to premature failure of the final product. Aim of this paper is the detection of local delamination spots through pre-existing optical techniques. This novel non-destructive method will allow the isolation of defective devices during production or warn the overall system during operation, if a failure is imminent.
Author(s)
Huai, Haosu
Univ. Freiburg
Laskin, Gennadii  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Fratz, Markus  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Seyler, Tobias  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Beckmann, Tobias
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Bertz, Alexander  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Wilde, Jürgen
Univ. Freiburg
Mainwork
SMSI 2021, Sensor and Measurement Science International  
Conference
Conference "Sensor and Measurement Science International" (SMSI) 2021  
Link
Link
DOI
10.5162/SMSI2021/C9.3
Additional full text version
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Language
English
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Keyword(s)
  • power electronics

  • reliability

  • non-destructive testing

  • Thermal-Mechanical Analysis

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