Simulations of stress-strain heterogeneities in copper thin films: Texture and substrate effects

Finite element simulations of the elastic and elasticplastic deformation of copper thin films are performed in the presence or not of substrate. The investigated textures are {111} and {001}. In the anisotropic elastic case, {001} films are associated with more strain heterogeneities than {111} films. Strong plastic strain heterogeneities are found in {001} films. The presence of a substrate increases significantly the heterogeneity of stressstrain fields.