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Foreword to the special section of the Asian Green Electronics Conference (AGEC)
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2004
Journal Article
Title
Foreword to the special section of the Asian Green Electronics Conference (AGEC)
Author(s)
Liu, J.
Griese, H.J.
Chan, Y.-C.
Journal
IEEE Transactions on Electronics Packaging Manufacturing
DOI
10.1109/TEPM.2005.844477
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
