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Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
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2009
Journal Article
Title
Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
Author(s)
Courtois, B.
Michel, B.
Journal
Microsystem Technologies
DOI
10.1007/s00542-009-0887-1
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Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
