The Printed Circuit Board (PCB) follows IC-Packaging to a Multi-Functional Board (MFB)

Independent of all expected technological advances in the semiconductor-technology, also one task will remain the division of complex function units and the necessity of the assembly resultant from it of single components on a PCB far into the future enough relevant task. There will be the one-chip-solution for complex electronic constructions only in the rarest cases. It must be recognized, a continuous growing together of chip- and board-level takes place.