Modular modeling of RF behavior of interconnect structures in 3D integration

Currently, 3D integration is still characterized by stacking of similar dies (e.g. memories or cpus) which are mostly connected to each other at their outer boundaries using bond wires. Nevertheless, first steps are done towards the combination of different functional units (sensor, micro controller, radio ...) which are usually not designed for 3D integration. The dies are adapted to current packaging technologies, like e.g. TQFP, concerning mounting, location and size of pads... [1]. Interposers containing rewiring and interchip vias (ICVs) are often used to be able to connect these units together [2]. The future potential will lay in real 3D systems. There we will encounter short signal paths enabling among others performing very efficient signal processing for sensor array structures, parallel computing ... But, due to dense integration of the 3D system a lot of physical interactions within the 3D systems exist.