Micro-optics soldering on multifunctional system platforms

Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding for optoelectronical systems is introduced. Using a solder alloy that can be processed fluxless (e.g. 80Au20Sn) more functionality than pure position securing, for instance electrical connections and heat sinks for laseroptics, can be incorporated into the joint. Along with smart system platforms, made from ceramics and composites, providing the right interfaces for such functional joints a dense integration of optical and heat generating electrooptical components becomes possible.