Electrooptical Integration of an Electronic Photonic Integrated Circuit Into Plastic Substrates Using Mid-Technology

This paper presents the electrical and optical integration of an electronic photonic integrated circuit (EPIC) on a plastic substrate using mechatronic integrated device (MID) techniques. The paper details all the necessary process steps for the optical alignment and the gluing of the fiber to the EPIC on the plastic substrate. Electro-optical measurements were performed, and the assembled chip provides a 3 dB bandwidth of 12.7 GHz. The results presented in this paper can be reused without modification for the integration of a 77 GHz photonic radar EPIC with optical local oscillator (LO) distribution into a plastic bumper.