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  4. Comparison between 65nm bulk and PD-SOI MOSFETs. Si/BOX interface effect on point defects and doping profiles
 
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2009
Conference Paper
Title

Comparison between 65nm bulk and PD-SOI MOSFETs. Si/BOX interface effect on point defects and doping profiles

Other Title
Vergleich ziwschen 65 nm Bulk- und PD-SOI-MOSFETs: Effekte der Grenzschicht zwischen Silcium und vergrabenem Oxid auf Punktdefekte und Dotierstoffprofile
Abstract
In this work, the influence of the silicon/Buried OXide interface (Si/BOX) on the electrical characteristics of Silicon-On-Insulator (SOI) MOSFETs is investigated by means of numerical simulations. Considering the state-of-the-art dopant diffusion models and the effect of Si/BOX interface as a point defect sink, process simulations were performed to investigate the two-dimensional diffusion behaviour of the dopant impurities. The impact of the Si/BOX interface on the shape of the different active zones profiles was investigated by analyzing the standard electrical characteristics of CMOS devices. Finally, a new electrical characterization methodology is detailed to better analyze dopants lateral diffusion profiles.
Author(s)
Bazizi, E.M.
Pakfar, A.
Fazzini, P.F.
Cristiano, F.
Tavernier, C.
Claverie, A.
Burenkov, A.  
Pichler, P.  orcid-logo
Mainwork
ESSDERC / ESSCIRC 2009  
Conference
European Solid-State Device Research Conference (ESSDERC) 2009  
European Solid State Circuits Conference (ESSCIRC) 2009  
DOI
10.1109/ESSDERC.2009.5331510
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • SOI

  • MOSFET

  • point defects

  • doping

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