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Design, test, integration and packaging of MEMS/MOEMS, 2005
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2006
Conference Paper
Title
Design, test, integration and packaging of MEMS/MOEMS, 2005
Author(s)
Courtois, B.
Michel, Bernd
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Mainwork
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2005. Special issue
Conference
Symposium of Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2005
DOI
10.1007/s00542-006-0114-2
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
