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Corrosion Resistant Packaging for Power Semiconductor Modules - Modified Insulation Materials for Contaminated Environments
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September 2024
Conference Paper
Title
Corrosion Resistant Packaging for Power Semiconductor Modules - Modified Insulation Materials for Contaminated Environments
Author(s)
Hanf, Michael
Brinkmann, Andreas
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
Deißenberger, Andrea
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
Kaminski, Nando
Stenzel, Volkmar
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
Mainwork
PCIM Europe 2024, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Project(s)
Intelligent Reliability 4.0
Funder
European Commission
Conference
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management 2024
DOI
10.30420/566262043
Language
English
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
