• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Challenges and simulation solutions for advanced lithography for nanometer interconnect patterning
 
  • Details
  • Full
Options
2016
Presentation
Title

Challenges and simulation solutions for advanced lithography for nanometer interconnect patterning

Title Supplement
Presentation held at SISPAD Workshop WS1 "Simulation of Advanced Interconnects", September 5, 2016, Nuremberg, Germany
Author(s)
Evanschitzky, Peter  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
Workshop WS1 "Simulation of Advanced Interconnects" 2016  
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2016  
File(s)
Download (7.78 MB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-395951
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024