2016
Presentation
Titel

Challenges and simulation solutions for advanced lithography for nanometer interconnect patterning
Titel Supplements
Presentation held at SISPAD Workshop WS1 "Simulation of Advanced Interconnects", September 5, 2016, Nuremberg, Germany
Author(s)
Evanschitzky, Peter
FhG IISB
Konferenz
File(s)
Language
English