2023
Conference Paper
Title

Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging

Abstract
This work presents a heating technology for multi-die attach based on inductive silver sintering. Thus, the heat for the sintering reaction is confined locally to the bond region, avoiding heating of the entire power module.
Author(s)
Hofmann, Christian  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Rochala, Patrick
Technische Universität Chemnitz
Kroll, Martin
Technische Universität Chemnitz
Panhale, Sushant
Technische Universität Chemnitz
Baum, Mario  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Kuhn, Harald  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Oi, Kiyoshi
Shinko Electric Industries Co.,Ltd.
Sanada, Masaki
Shinko Electric Industries Co.,Ltd.
Murayama, Kei
Shinko Electric Industries Co.,Ltd.
Mainwork
2023 IEEE CPMT Symposium Japan Icsj 2023
Conference
12th IEEE CPMT Symposium Japan, ICSJ 2023
DOI
Language
English
Keyword(s)