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  4. Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP
 
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2009
Journal Article
Title

Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP

Abstract
The method of the capacitive coupled transmission line pulsing (CC-TLP) is applied to a product IC at package level and for the first time at wafer level. The investigated product showed a field failure which could be reproduced by the CDM. The application of the CC-TLP to the product at package and wafer level also reproduced the field failure. Furthermore the measured failure currents correlate very well with the failure currents under CDM conditions.
Author(s)
Wolf, H.
Gieser, H.
Walter, D.
Journal
Microelectronics reliability  
DOI
10.1016/j.microrel.2009.10.006
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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