2005
Conference Paper
Title

Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions

Title Supplement
Abstract
Author(s)
Dudek, R.
Döring, R.
Michel, B.
Picault, A.
Autissier, J.-F.
Mainwork
Conference
Language
English