2011
Conference Proceeding
Title

Stress management for 3D ICs using through silicon vias

Title Supplement
International Workshop on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, March 16, 2010; San Francisco, CA, July 13, 2010; Dresden, Germany, October 20, 2010
Person Involved
Zschech, E.
Corporate Author
American Institute of Physics -AIP-, New York
Publisher
Publishing Place
New York, N.Y.
Conference
Language
English